APA način citiranja (7. izdanje)

Balaramesh P, Rekha S, Venkatesh P, Shanmugan S, & International Research Journal of Chemical Science. Electroless copper deposition using saccharose containing copper methane sulphonate bath with thiourea as stabilizer.

Čikaški stil citiranja (17. izdanje)

Balaramesh P, Rekha S, Venkatesh P, Shanmugan S, i International Research Journal of Chemical Science. Electroless Copper Deposition Using Saccharose Containing Copper Methane Sulphonate Bath with Thiourea as Stabilizer.

MLA način citiranja (9. izdanje)

Balaramesh P, et al. Electroless Copper Deposition Using Saccharose Containing Copper Methane Sulphonate Bath with Thiourea as Stabilizer.

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