APA引文

Balaramesh P, Rekha S, Venkatesh P, Shanmugan S, & International Research Journal of Chemical Science. Electroless copper deposition using saccharose containing copper methane sulphonate bath with thiourea as stabilizer.

Chicago Style (17th ed.) Citation

Balaramesh P, Rekha S, Venkatesh P, Shanmugan S, and International Research Journal of Chemical Science. Electroless Copper Deposition Using Saccharose Containing Copper Methane Sulphonate Bath with Thiourea as Stabilizer.

MLA引文

Balaramesh P, et al. Electroless Copper Deposition Using Saccharose Containing Copper Methane Sulphonate Bath with Thiourea as Stabilizer.