APA (7e ed.) Bronvermelding

Balaramesh P, Rekha S, Venkatesh P, Shanmugan S, & International Research Journal of Chemical Science. Electroless copper deposition using saccharose containing copper methane sulphonate bath with thiourea as stabilizer.

Chicago (17e ed.) Bronvermelding

Balaramesh P, Rekha S, Venkatesh P, Shanmugan S, en International Research Journal of Chemical Science. Electroless Copper Deposition Using Saccharose Containing Copper Methane Sulphonate Bath with Thiourea as Stabilizer.

MLA (9e ed.) Bronvermelding

Balaramesh P, et al. Electroless Copper Deposition Using Saccharose Containing Copper Methane Sulphonate Bath with Thiourea as Stabilizer.