APA (7 वां संस्करण) प्रशस्ति पत्र

Balaramesh P, Rekha S, Venkatesh P, Shanmugan S, & International Research Journal of Chemical Science. Electroless copper deposition using saccharose containing copper methane sulphonate bath with thiourea as stabilizer.

शिकागो शैली (17वां संस्करण) प्रशस्ति पत्र

Balaramesh P, Rekha S, Venkatesh P, Shanmugan S, और International Research Journal of Chemical Science. Electroless Copper Deposition Using Saccharose Containing Copper Methane Sulphonate Bath with Thiourea as Stabilizer.

एमएलए (9वां संस्करण) प्रशस्ति पत्र

Balaramesh P, et al. Electroless Copper Deposition Using Saccharose Containing Copper Methane Sulphonate Bath with Thiourea as Stabilizer.

चेतावनी: ये उद्धरण हमेशा 100% सटीक नहीं हो सकते हैं.