Anik T, Ebn Touhami M., Himm K, Schireen S, Belkhmima R.A, Abouchane M, . . . Electrochemical Science Group, U. o. B. Influence of pH solution on electroless copper plating using sodium hypophosphite as reducing agent.
Chicago Style (17th ed.) CitationAnik T, Ebn Touhami M., Himm K, Schireen S, Belkhmima R.A, Abouchane M, Ciss ̌M, and University of Belgrade Electrochemical Science Group. Influence of PH Solution on Electroless Copper Plating Using Sodium Hypophosphite as Reducing Agent.
MLA (9th ed.) CitationAnik T, et al. Influence of PH Solution on Electroless Copper Plating Using Sodium Hypophosphite as Reducing Agent.
Warning: These citations may not always be 100% accurate.