Cita APA (7th ed.)

Anik T, Ebn Touhami M., Himm K, Schireen S, Belkhmima R.A, Abouchane M, . . . Electrochemical Science Group, U. o. B. Influence of pH solution on electroless copper plating using sodium hypophosphite as reducing agent.

Cita Chicago (17th ed.)

Anik T, Ebn Touhami M., Himm K, Schireen S, Belkhmima R.A, Abouchane M, Ciss ̌M, i University of Belgrade Electrochemical Science Group. Influence of PH Solution on Electroless Copper Plating Using Sodium Hypophosphite as Reducing Agent.

Cita MLA (9th ed.)

Anik T, et al. Influence of PH Solution on Electroless Copper Plating Using Sodium Hypophosphite as Reducing Agent.