APA aipamena

Anik T, Ebn Touhami M., Himm K, Schireen S, Belkhmima R.A, Abouchane M, . . . Electrochemical Science Group, U. o. B. Influence of pH solution on electroless copper plating using sodium hypophosphite as reducing agent.

Chicago Style aipamena

Anik T, Ebn Touhami M., Himm K, Schireen S, Belkhmima R.A, Abouchane M, Ciss ̌M, and University of Belgrade Electrochemical Science Group. Influence of PH Solution on Electroless Copper Plating Using Sodium Hypophosphite as Reducing Agent.

MLA aipamena

Anik T, et al. Influence of PH Solution on Electroless Copper Plating Using Sodium Hypophosphite as Reducing Agent.