Anik T, Ebn Touhami M., Himm K, Schireen S, Belkhmima R.A, Abouchane M, . . . Electrochemical Science Group, U. o. B. Influence of pH solution on electroless copper plating using sodium hypophosphite as reducing agent.
Čikaški stil citiranja (17. izdanje)Anik T, Ebn Touhami M., Himm K, Schireen S, Belkhmima R.A, Abouchane M, Ciss ̌M, i University of Belgrade Electrochemical Science Group. Influence of PH Solution on Electroless Copper Plating Using Sodium Hypophosphite as Reducing Agent.
MLA način citiranja (9. izdanje)Anik T, et al. Influence of PH Solution on Electroless Copper Plating Using Sodium Hypophosphite as Reducing Agent.
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