Citazione Stile APA (7a Edizione)

Anik T, Ebn Touhami M., Himm K, Schireen S, Belkhmima R.A, Abouchane M, . . . Electrochemical Science Group, U. o. B. Influence of pH solution on electroless copper plating using sodium hypophosphite as reducing agent.

Citazione stile Chigago Style (17a edizione)

Anik T, Ebn Touhami M., Himm K, Schireen S, Belkhmima R.A, Abouchane M, Ciss ̌M, e University of Belgrade Electrochemical Science Group. Influence of PH Solution on Electroless Copper Plating Using Sodium Hypophosphite as Reducing Agent.

Citatione MLA (9a ed.)

Anik T, et al. Influence of PH Solution on Electroless Copper Plating Using Sodium Hypophosphite as Reducing Agent.