Influence of pH solution on electroless copper plating using sodium hypophosphite as reducing agent
En esta investigacin̤ se estudi ̤el efecto del pH de la solucin̤ sobre la deposicin̤ qum̕ica de aleaciones Cu<U+0096>Ni<U+0096>P ricas en cobre empleando hipofosfito de sodio como agente reductor. La velocidad de deposicin̤ se increment ̤con el aumento del pH. Asimismo, la rugosidad y la...
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| Language: | English |
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| Online Access: | Influence of pH solution on electroless copper plating using sodium hypophosphite as reducing agent |
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| 001 | vpro9689 | ||
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| 008 | 160310s2016 ck # g## #001 0#eng#d | ||
| 020 | |||
| 022 | |a 1452-3981 | ||
| 040 | |a CO-BoINGC | ||
| 041 | 0 | |a eng | |
| 245 | 1 | 0 | |a Influence of pH solution on electroless copper plating using sodium hypophosphite as reducing agent |
| 246 | |a Influencia del pH de la solucin̤ sobre el cobreado qum̕ico usando hipofosfito de sodio como agente reductor | ||
| 264 | |a Bogot ̀(Colombia) : |b Revista VirtualPRO, |c 2016 | ||
| 520 | 3 | |a En esta investigacin̤ se estudi ̤el efecto del pH de la solucin̤ sobre la deposicin̤ qum̕ica de aleaciones Cu<U+0096>Ni<U+0096>P ricas en cobre empleando hipofosfito de sodio como agente reductor. La velocidad de deposicin̤ se increment ̤con el aumento del pH. Asimismo, la rugosidad y la cristalinidad manifiestan una dependencia estrecha de este factor. Se analiz ̤la cinťica de la reaccin̤ mediante voltametra̕ cc̕lica y espectroscopa̕ de impedancia electroqum̕ica. | |
| 650 | \ | \ | |a Qum̕ica |
| 650 | \ | \ | |a Fisicoqum̕ica |
| 650 | \ | \ | |a Ciencias qum̕icas |
| 650 | \ | \ | |a Aleaciones |
| 650 | \ | \ | |a Chemistry |
| 650 | \ | \ | |a Chemistry |
| 650 | \ | \ | |a physical and theoretical |
| 650 | \ | \ | |a Chemical sciences |
| 650 | \ | \ | |a Alloys |
| 650 | \ | \ | |a Recubrimientos |
| 650 | \ | \ | |a Recubrimientos metl̀icos |
| 650 | \ | \ | |a Cobreado qum̕ico |
| 650 | \ | \ | |a Cobre |
| 650 | \ | \ | |a Morfologa̕ de superficie |
| 650 | \ | \ | |a Cristalinidad |
| 650 | \ | \ | |a Coatings |
| 650 | \ | \ | |a Metal coatings |
| 650 | \ | \ | |a Chemical coatings |
| 650 | \ | \ | |a Copper |
| 650 | \ | \ | |a Surface morphology |
| 650 | \ | \ | |a Crystallinity |
| 700 | \ | \ | |a Anik T. |
| 700 | \ | \ | |a Ebn Touhami M. |
| 700 | \ | \ | |a Himm K. |
| 700 | \ | \ | |a Schireen S. |
| 700 | \ | \ | |a Belkhmima R.A. |
| 700 | \ | \ | |a Abouchane M. |
| 700 | \ | \ | |a Ciss ̌M. |
| 700 | \ | \ | |a Electrochemical Science Group, University of Belgrade |
| 856 | |z Influence of pH solution on electroless copper plating using sodium hypophosphite as reducing agent |u https://virtualpro.unach.elogim.com/biblioteca/influencia-del-ph-de-la-solucion-sobre-el-cobreado-quimico-usando-hipofosfito-de-sodio-como-agente-reductor | ||