Influence of pH solution on electroless copper plating using sodium hypophosphite as reducing agent
En esta investigacin̤ se estudi ̤el efecto del pH de la solucin̤ sobre la deposicin̤ qum̕ica de aleaciones Cu<U+0096>Ni<U+0096>P ricas en cobre empleando hipofosfito de sodio como agente reductor. La velocidad de deposicin̤ se increment ̤con el aumento del pH. Asimismo, la rugosidad y la...
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| Ētahi atu kaituhi: | , , , , , , , |
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| Hōputu: | Pukapuka |
| Reo: | Ingarihi |
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| Urunga tuihono: | Influence of pH solution on electroless copper plating using sodium hypophosphite as reducing agent |
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