APA-viite (7. p.)

Bai De Kui, Ying Quan Hong, Wang Ni, Lin Jin Hui, & Hindawi Publishing Corporation. Copper removal from electroplating wastewater by coprecipitation of copper-based supramolecular materials , preparation and application study.

Chicago-viite (17. p.)

Bai De Kui, Ying Quan Hong, Wang Ni, Lin Jin Hui, ja Hindawi Publishing Corporation. Copper Removal from Electroplating Wastewater by Coprecipitation of Copper-based Supramolecular Materials , Preparation and Application Study.

MLA-viite (9. p.)

Bai De Kui, et al. Copper Removal from Electroplating Wastewater by Coprecipitation of Copper-based Supramolecular Materials , Preparation and Application Study.

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