Bai De Kui, Ying Quan Hong, Wang Ni, Lin Jin Hui, & Hindawi Publishing Corporation. Copper removal from electroplating wastewater by coprecipitation of copper-based supramolecular materials , preparation and application study.
शिकागो शैली (17वां संस्करण) प्रशस्ति पत्रBai De Kui, Ying Quan Hong, Wang Ni, Lin Jin Hui, और Hindawi Publishing Corporation. Copper Removal from Electroplating Wastewater by Coprecipitation of Copper-based Supramolecular Materials , Preparation and Application Study.
एमएलए (9वां संस्करण) प्रशस्ति पत्रBai De Kui, et al. Copper Removal from Electroplating Wastewater by Coprecipitation of Copper-based Supramolecular Materials , Preparation and Application Study.
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