Fujiwara Shinichi, Dauskardt Reinhold H., & The Japan Institute of Metals and Materials. Interface Structure of Cu Wire Bonding on Cu Substrate with Sn Plating.
Chicago Style (17th ed.) CitationFujiwara Shinichi, Dauskardt Reinhold H., and The Japan Institute of Metals and Materials. Interface Structure of Cu Wire Bonding on Cu Substrate with Sn Plating.
MLA (9th ed.) CitationFujiwara Shinichi, et al. Interface Structure of Cu Wire Bonding on Cu Substrate with Sn Plating.
Warning: These citations may not always be 100% accurate.