Cita APA (7th ed.)

Fujiwara Shinichi, Dauskardt Reinhold H., & The Japan Institute of Metals and Materials. Interface Structure of Cu Wire Bonding on Cu Substrate with Sn Plating.

Cita Chicago (17th ed.)

Fujiwara Shinichi, Dauskardt Reinhold H., i The Japan Institute of Metals and Materials. Interface Structure of Cu Wire Bonding on Cu Substrate with Sn Plating.

Cita MLA (9th ed.)

Fujiwara Shinichi, et al. Interface Structure of Cu Wire Bonding on Cu Substrate with Sn Plating.