APA aipamena

Fujiwara Shinichi, Dauskardt Reinhold H., & The Japan Institute of Metals and Materials. Interface Structure of Cu Wire Bonding on Cu Substrate with Sn Plating.

Chicago Style aipamena

Fujiwara Shinichi, Dauskardt Reinhold H., and The Japan Institute of Metals and Materials. Interface Structure of Cu Wire Bonding on Cu Substrate with Sn Plating.

MLA aipamena

Fujiwara Shinichi, et al. Interface Structure of Cu Wire Bonding on Cu Substrate with Sn Plating.