Fujiwara Shinichi, Dauskardt Reinhold H., & The Japan Institute of Metals and Materials. Interface Structure of Cu Wire Bonding on Cu Substrate with Sn Plating.
Chicagoスタイル(17版)引用形式Fujiwara Shinichi, Dauskardt Reinhold H., , The Japan Institute of Metals and Materials. Interface Structure of Cu Wire Bonding on Cu Substrate with Sn Plating.
MLA(9版)引用形式Fujiwara Shinichi, et al. Interface Structure of Cu Wire Bonding on Cu Substrate with Sn Plating.
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