Fujiwara Shinichi, Dauskardt Reinhold H., & The Japan Institute of Metals and Materials. Interface Structure of Cu Wire Bonding on Cu Substrate with Sn Plating.
Citação norma ChicagoFujiwara Shinichi, Dauskardt Reinhold H., and The Japan Institute of Metals and Materials. Interface Structure of Cu Wire Bonding on Cu Substrate with Sn Plating.
Citação norma MLAFujiwara Shinichi, et al. Interface Structure of Cu Wire Bonding on Cu Substrate with Sn Plating.
Nota: a formatação da citação pode não corresponder 100% ao definido pela respectiva norma.