APA citiranje

Fujiwara Shinichi, Dauskardt Reinhold H., & The Japan Institute of Metals and Materials. Interface Structure of Cu Wire Bonding on Cu Substrate with Sn Plating.

Chicago Style (17th ed.) Citation

Fujiwara Shinichi, Dauskardt Reinhold H., and The Japan Institute of Metals and Materials. Interface Structure of Cu Wire Bonding on Cu Substrate with Sn Plating.

MLA citiranje

Fujiwara Shinichi, et al. Interface Structure of Cu Wire Bonding on Cu Substrate with Sn Plating.