Miller Alexander T. & OhioLINK. Direct Electroless Copper Plating on Glass Mediated by Solution-Phase Deposition of Nucleation and Adhesion Promoters.
Chicago Style (17th ed.) CitationMiller Alexander T. and OhioLINK. Direct Electroless Copper Plating on Glass Mediated by Solution-Phase Deposition of Nucleation and Adhesion Promoters.
MLA (9th ed.) CitationMiller Alexander T. and OhioLINK. Direct Electroless Copper Plating on Glass Mediated by Solution-Phase Deposition of Nucleation and Adhesion Promoters.
Warning: These citations may not always be 100% accurate.