Miller Alexander T. & OhioLINK. Direct Electroless Copper Plating on Glass Mediated by Solution-Phase Deposition of Nucleation and Adhesion Promoters.
Citace podle Chicago (17th ed.)Miller Alexander T. a OhioLINK. Direct Electroless Copper Plating on Glass Mediated by Solution-Phase Deposition of Nucleation and Adhesion Promoters.
Citace podle MLA (9th ed.)Miller Alexander T. a OhioLINK. Direct Electroless Copper Plating on Glass Mediated by Solution-Phase Deposition of Nucleation and Adhesion Promoters.
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