Miller Alexander T. & OhioLINK. Direct Electroless Copper Plating on Glass Mediated by Solution-Phase Deposition of Nucleation and Adhesion Promoters.
Čikaški stil citiranja (17. izdanje)Miller Alexander T. i OhioLINK. Direct Electroless Copper Plating on Glass Mediated by Solution-Phase Deposition of Nucleation and Adhesion Promoters.
MLA način citiranja (9. izdanje)Miller Alexander T. i OhioLINK. Direct Electroless Copper Plating on Glass Mediated by Solution-Phase Deposition of Nucleation and Adhesion Promoters.
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