Miller Alexander T. & OhioLINK. Direct Electroless Copper Plating on Glass Mediated by Solution-Phase Deposition of Nucleation and Adhesion Promoters.
Chicagoスタイル(17版)引用形式Miller Alexander T. , OhioLINK. Direct Electroless Copper Plating on Glass Mediated by Solution-Phase Deposition of Nucleation and Adhesion Promoters.
MLA(9版)引用形式Miller Alexander T. , OhioLINK. Direct Electroless Copper Plating on Glass Mediated by Solution-Phase Deposition of Nucleation and Adhesion Promoters.
警告: この引用は必ずしも正確ではありません.