Miller Alexander T. & OhioLINK. Direct Electroless Copper Plating on Glass Mediated by Solution-Phase Deposition of Nucleation and Adhesion Promoters.
Chicago-referens (17:e uppl.)Miller Alexander T. och OhioLINK. Direct Electroless Copper Plating on Glass Mediated by Solution-Phase Deposition of Nucleation and Adhesion Promoters.
MLA-referens (9:e uppl.)Miller Alexander T. och OhioLINK. Direct Electroless Copper Plating on Glass Mediated by Solution-Phase Deposition of Nucleation and Adhesion Promoters.
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