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Application of environment-friendly ligands for alkaline electroless copper plating systems , a comparative study of electroless copper deposition using D-, L- and DL-tartrate as C...

Application of environment-friendly ligands for alkaline electroless copper plating systems , a comparative study of electroless copper deposition using D-, L- and DL-tartrate as Cu(II) ligands

Comparative study of electroless copper film on different self-assembled monolayers modified ABS substrate

Comparative study of electroless copper film on different self-assembled monolayers modified ABS substrate

Electroless copper deposition using saccharose containing copper methane sulphonate bath with thiourea as stabilizer

Electroless copper deposition using saccharose containing copper methane sulphonate bath with thiourea as stabilizer

Formulation of novel electroless plating process for Cu and Cu-P alloys

Formulation of novel electroless plating process for Cu and Cu-P alloys

Effect of electroless copper coating on the corrosion behavior of aluminium based metal matrix composites reinforced with silicon carbide particles

Effect of electroless copper coating on the corrosion behavior of aluminium based metal matrix composites reinforced with silicon carbide particles