Canlyniadau Chwilio

Formulation of novel electroless plating process for Cu and Cu-P alloys

Formulation of novel electroless plating process for Cu and Cu-P alloys

Influence of pH solution on electroless copper plating using sodium hypophosphite as reducing agent

Influence of pH solution on electroless copper plating using sodium hypophosphite as reducing agent

Effect of electroless copper coating on the corrosion behavior of aluminium based metal matrix composites reinforced with silicon carbide particles

Effect of electroless copper coating on the corrosion behavior of aluminium based metal matrix composites reinforced with silicon carbide particles

Adsorption of Pb, Fe, Cu, and Zn from industrial electroplating wastewater by orange peel activated carbon

Adsorption of Pb, Fe, Cu, and Zn from industrial electroplating wastewater by orange peel activated carbon

Anl̀isis del ciclo de vida de los procesos de recubrimiento metl̀ico de termopls̀ticos

Anl̀isis del ciclo de vida de los procesos de recubrimiento metl̀ico de termopls̀ticos

Bioremoval of chromium, nickel and zinc in electroplating effluent by pseudomonas aeruginosa

Bioremoval of chromium, nickel and zinc in electroplating effluent by pseudomonas aeruginosa

Caracterizacin̤ de dos escorias provenientes del proceso de galvanizado en caliente y evaluacin̤ de su lixiviabilidad estt̀ica en presencia de elevados contenidos de materia orgǹi...

Caracterizacin̤ de dos escorias provenientes del proceso de galvanizado en caliente y evaluacin̤ de su lixiviabilidad estt̀ica en presencia de elevados contenidos de materia orgǹica

Recovery and reuse of hexavalent chromium from aqueous solutions by a hybrid technique of electrodialysis and Ion exchange

Recovery and reuse of hexavalent chromium from aqueous solutions by a hybrid technique of electrodialysis and Ion exchange

Recovery of cobalt and copper from textile, electroplating and tannery effluents using electrocoagulation method

Recovery of cobalt and copper from textile, electroplating and tannery effluents using electrocoagulation method

Study of the electrocoagulation of electroplating industry wastewaters charged by nickel (II) and chromium (VI)

Study of the electrocoagulation of electroplating industry wastewaters charged by nickel (II) and chromium (VI)

Copper removal from electroplating wastewater by coprecipitation of copper-based supramolecular materials , preparation and application study

Copper removal from electroplating wastewater by coprecipitation of copper-based supramolecular materials , preparation and application study

Toxicity effects of nickel electroplating effluents treated by photoelectrooxidation in the industries of the sinos river basin

Toxicity effects of nickel electroplating effluents treated by photoelectrooxidation in the industries of the sinos river basin

Influencia de la suplementacin̤ de antioxidantes y de la administracin̤ de enrofloxacina en la seguridad y la calidad de la carne de ave

Influencia de la suplementacin̤ de antioxidantes y de la administracin̤ de enrofloxacina en la seguridad y la calidad de la carne de ave

ℓnodos para un baǫ de electroplateado de cromo trivalente

ℓnodos para un baǫ de electroplateado de cromo trivalente

Experimental investigation of nickel electrodeposits brightness in the presence of surfactants , modeling, optimization and polarization studies

Experimental investigation of nickel electrodeposits brightness in the presence of surfactants , modeling, optimization and polarization studies

Mod-01, Lec-21. Electroplating, Anodizing and Electro-Less Plating

Mod-01, Lec-21. Electroplating, Anodizing and Electro-Less Plating

SFCM 13/14 16. Recubrimientos con aplicaciones industriales

SFCM 13/14 16. Recubrimientos con aplicaciones industriales

SFCM 12/13 9. La electrodeposicin̤ se encuentra con la nanotecnologa̕

SFCM 12/13 9. La electrodeposicin̤ se encuentra con la nanotecnologa̕

Seminario CICATA. Catalizadores y recubrimientos nanoestructurados. Dr. Miguel A. Domn̕guez Crespo

Seminario CICATA. Catalizadores y recubrimientos nanoestructurados. Dr. Miguel A. Domn̕guez Crespo

30 years of electroless plating for semiconductor and polymer micro-systems

30 years of electroless plating for semiconductor and polymer micro-systems