Electroless deposition and electroplating of metals

Electroless deposition and electroplating of metals

Junto con los procedimientos multiprops̤ito de deposicin̤ de metales a bajas temperaturas mediante reduccin̤ electroqum̕ica de sus compuestos solubles, tambiň est ̀la posibilidad de reduccin̤ no electrolt̕ica, qum̕ica o autocatalt̕ica (electroless) de diversos metales en soluciones. En ambos casos,...

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Bibliografiske detaljer
Andre forfattere:	Sviridov V. V., Gaevskaya T. V., Stepanova L. I., Vorobyova T. N., Belarusian State University (BSU)
Format:	Bog
Sprog:	engelsk
Fag:	Cinťica Ciencias qum̕icas Aleaciones Electroqum̕ica Fisicoqum̕ica Qum̕ica Kinetics Chemical sciences Alloys Electrochemistry Chemistry physical and theoretical Electroplateado Revestimiento qum̕ico Recubrimientos metl̀icos Catl̀isis Pelc̕ulas de nq̕uel Pelc̕ulas de cobre Pelc̕ulas de oro Pelc̕ulas de plata Electroplating Chemical coating Metal coatings Catalysis Nickel films Copper films Gold films Silver films
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Lignende værker

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Antimicrobial films , a review

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Influence of operation parameters on metal deposition in bright nickel-plating process

Estudio de pelc̕ulas and̤icas de aluminio formadas en c̀ido crm̤ico por espectroscopa̕ de impedancia electroqum̕ica

Chromium electroplating of aluminium alloys using electroless nickel as underlayer

Electroplating for Decorative Applications, Recent Trends in Research and Development Study

Influencia de los parm̀etros de electrodeposicin̤ en la resistencia a la corrosin̤ de recubrimientos Ni-Sn

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Influence of Si Atoms Insertion on the Formation of the Ti-Si-N Composite by DFT Simulation

Formulation of novel electroless plating process for Cu and Cu-P alloys

30 years of electroless plating for semiconductor and polymer micro-systems

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Electroless copper deposition using saccharose containing copper methane sulphonate bath with thiourea as stabilizer

Study of the electrocoagulation of electroplating industry wastewaters charged by nickel (II) and chromium (VI)

Effect of some process variables on nickel electroplating of low carbon steel

Effects of functional groups of triple bonds containing molecules on nickel electroplating

Bioremoval of chromium, nickel and zinc in electroplating effluent by pseudomonas aeruginosa

Properties of immersion tin coatings deposition from methanesulphonic acid solutions

Influence of pH solution on electroless copper plating using sodium hypophosphite as reducing agent

Electroless tin deposition on copper from thiourea type baths

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Application of environment-friendly ligands for alkaline electroless copper plating systems , a comparative study of electroless copper deposition using D-, L- and DL-tartrate as Cu(II) ligands

Comparative study of electroless copper film on different self-assembled monolayers modified ABS substrate

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