Direct Electroless Copper Plating on Glass Mediated by Solution-Phase Deposition of Nucleation and Adhesion Promoters
Las interfaces metal-dielčtrico se encuentran comn͠mente en varias aplicaciones electrn̤icas, entre ellas tarjetas de circuitos impresos y aparatos integrados. Mientras que las aplicaciones exigen una adhesin̤ interfacial fuerte, la adhesin̤ intrn̕seca entre pelc̕ulas metl̀icas y sustratos dielčtr...
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| Ētahi atu kaituhi: | , |
|---|---|
| Hōputu: | Pukapuka |
| Reo: | Ingarihi |
| Ngā marau: | |
| Urunga tuihono: | Direct Electroless Copper Plating on Glass Mediated by Solution-Phase Deposition of Nucleation and Adhesion Promoters |
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