Electroless tin deposition on copper from thiourea type baths
Los recubrimientos de estaǫ por inmersin̤ sobre superficies de cobre se pueden llevar a cabo de dos maneras: mediante un proceso de dismutacin̤ (disproportionation) de Sn(II) o por una reaccin̤ de desplazamiento entre el cobre y el estaǫ. En este documento se analiza la correlacin̤ entre la veloci...
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| Andre forfattere: | Araźna Aneta, Silesian University of Technology |
|---|---|
| Format: | Bog |
| Sprog: | engelsk |
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| Online adgang: | Electroless tin deposition on copper from thiourea type baths |
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Lignende værker
- Preparation and characterization of copper powders with Sn coating by the electroless plating
- Electroless copper deposition using saccharose containing copper methane sulphonate bath with thiourea as stabilizer
- Modelling and control of tinning line entry section using neural networks
- Properties of immersion tin coatings deposition from methanesulphonic acid solutions
- Interface Structure of Cu Wire Bonding on Cu Substrate with Sn Plating